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Broadband Radiative Heat Transfer Suppression via Dispersion-Engineered Metasurfaces

2026-06-26 · Nature Communications

One-line summary

A solar energy research paper on Broadband Radiative Heat Transfer Suppression via Dispersion-Engineered Metasurfaces.

Engineering notes

Engineering notes will be added by the Power for Solar editorial team.

Chinese explanation / 中文解读

中文解读待补充:本站会优先为光伏效率、钙钛矿太阳能电池、储能技术、太阳能热利用、BIPV、并网技术等高价值论文补充中文说明。

Original abstract

Suppressing radiative heat transfer using metallic reflectors fails where electrical conduction or material incompatibility are prohibitive, whereas non-metallic alternatives that rely on conventional thermophotonic approaches face fundamental performance-bandwidth trade-offs, bounded by the Bode-Fano limit. Here, we redefine the strategy for broadband radiative suppression by leveraging complementary dispersion engineering in a dielectric metasurface pair. Using stochastic gradient descent (SGD) optimization, we co-design aperiodic distributed Bragg reflector (DBR) pairs with deliberately misaligned passbands across the broad thermal band of interest, enabling effective broadband thermal decoupling within a small thickness and fabrication budget, beyond the limits of conventional approaches. Experimental validation reveals that our optimized 7-layered (7-L) metasurface pair reduces radiative heat exchange significantly compared to fused silica benchmarks, as confirmed through both angle-resolved emissivity measurements (82% reduction) and direct radiometric power quantification (62.5% reduction). Importantly, our compact system exhibits strong robustness against design and fabrication tolerance and operational temperature drift (320-500 K). This work establishes a generalizable framework for bandwidth-unconstrained thermal radiation engineering, with applications in energy-efficient systems, thermal insulation and thermal management. By circumventing the need for metallic components, our approach opens new possibilities for controlling radiative heat transfer in an all-dielectric ultrathin platform.

5.0Engineering value
7.0Research novelty
4.0Business relevance

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